Intel FUP8X25S3NVDK - H-S Backplane PCI-E Comb 
Features 
Intel's MPN: 
FUP8X25S3NVDK 
  
  
    
  
    
    
      Brand Name : Intel
    
    
      Form Factor : Internal
    
    
      Number of 2.5" Bays : 8
    
    
      Number of Total Expansion Bays : 8
    
    
      Product Type : Drive Enclosure
    
    
   
 
  
  
    
  
    
      
        
          General Information 
         
       
      
         
      
         
      
        
          http://www.intel.com/ 
         
       
      
         
      
         
      
         
      
         
    
    
      
        
          I/O Expansions 
         
       
      
         
      
         
    
    
      
        
          Miscellaneous 
         
       
      
         
      
        
          
            1 x Drive Cage
             
            1 x Hot-swap Combination Backplane
             
            8 x Hot-swap Drive Carriers
             
            2 x PCI Data Cables 600mm
             
            1 x PCIe Slot Adapter Board
             
            1 x I2C Cable
             
            1 x PEM Cable
             
            ID Filler Panels
             
            1 x Power Adapter Cable Accessory
             
           
         
       
    
    
      
        
          Physical Characteristics 
         
       
      
         
    
   
 
 
 
Information 
 
* Indication only, please consult the supplier stock level below.
Stock Information 
  Our Qty in Stock Availability and ETA Our own stock 0 Usually 1-3 days (when supplier has stock)   Supplier's Qty in Stock Availability and ETA Updated Supplier one
0 31/10/25 09:10AM